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Title:
METHOD FOR MANUFACTURING ELECTROCONDUCTIVE LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/009839
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide a method for manufacturing an electroconductive laminate having excellent adhesion between an electroconductive layer and an overcoat layer. The present disclosure provides a method for manufacturing an electroconductive laminate 10 comprising a substrate 11 with an electroconductive layer 12 and an overcoat layer 13 laminated thereon, the method including the following steps. Step A: forming the electroconductive layer 12 on the substrate 11 by using an electroconductive ink containing metal nanoparticles and a first resin for ink. Step B: forming the overcoat layer 13 on the electroconductive layer 12 by using a composition for overcoat layer formation containing a resin for an overcoat layer and an solvent for an overcoat layer, where the absolute value of the difference between the SP value of the solvent and the SP value of the first resin for ink is not more than 1.0.

Inventors:
ITO YOUSUKE (JP)
Application Number:
PCT/JP2021/025307
Publication Date:
January 13, 2022
Filing Date:
July 05, 2021
Export Citation:
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Assignee:
DAICEL CORP (JP)
International Classes:
B22F1/00; B22F3/16; B22F7/04; B29C64/112; B33Y10/00; B82Y40/00; H01B13/00; H05K1/09; H05K3/10; H05K3/12; H05K3/28
Domestic Patent References:
WO2014021270A12014-02-06
Foreign References:
JP2011159922A2011-08-18
JP2014175187A2014-09-22
JP2018199259A2018-12-20
JP2007294996A2007-11-08
JP2020118060A2020-08-06
JP2019098683A2019-06-24
JP2020049813A2020-04-02
JP2018206697A2018-12-27
Other References:
ROBERT F. FADORS ET AL., POLYMER ENGINEERING AND SCIENCE, vol. 14, pages 151 - 154
Attorney, Agent or Firm:
GOTO & CO. (JP)
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