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Title:
METHOD FOR MANUFACTURING ELECTRODE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/212731
Kind Code:
A1
Abstract:
A method for manufacturing an electrode material, comprising molding and sintering a powder mixture of a solid solution powder of Cr and a heat-resistant element including Cr and a heat-resistant element (Mo, W, Ta, Nb, V, Zr, or the like) in a ratio in which Cr > the heat-resistant element in terms of weight ratio, Cu powder, and a low-melting metal powder (Bi, Sn, Se, Pb, or the like). The low-melting metal powder in a ratio of 0.30 wt% to 0.50 wt% is added to a powder mixture of Cu powder and the solid solution powder of Cr and the heat-resistant element, and the powder mixture in which the low-melting metal powder is added is sintered at a temperature of 1010°C to 1035°C. A powder having a median diameter of 5 µm to 20 µm is used as the low-melting metal powder.

Inventors:
HAYASHI SHOTA (JP)
ISHIKAWA KEITA (JP)
YAMAMURA KENTA (JP)
HASEGAWA KOSUKE (JP)
FUKUDA HIDEAKI (JP)
SANO AKIRA (JP)
Application Number:
PCT/JP2017/010426
Publication Date:
December 14, 2017
Filing Date:
March 15, 2017
Export Citation:
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Assignee:
MEIDENSHA ELECTRIC MFG CO LTD (JP)
International Classes:
C22C1/04; B22F1/00; B22F1/052; B22F3/10; B22F5/00; B22F9/08; C22C9/00; C22C27/06; C22C30/02; H01H33/662; H01H33/664
Foreign References:
JP2016023335A2016-02-08
JPS54147481A1979-11-17
JP2015138681A2015-07-30
JPH0973846A1997-03-18
JPH04334832A1992-11-20
JP2002180150A2002-06-26
JPH04334832A1992-11-20
JP2015138682A2015-07-30
JPH05198230A1993-08-06
JP2015093765A2015-05-18
JP2015126086A2015-07-06
JP2015161482A2015-09-07
Other References:
RIEDER, F. U.A.: "The Influence of Composition and Cr Particle Size of Cu/Cr Contacts on Chopping Current, Contact Resistance, and Breakdown Voltage in Vacuum Interrupters", IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS, AND MANUFACTURING TECHNOLOGY, vol. 12, 1989, pages 273 - 283, XP000904661, DOI: doi:10.1109/33.31434
See also references of EP 3470538A4
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (JP)
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