Title:
METHOD FOR MANUFACTURING AN ELECTRODEPOSITED DIAMOND WIRE SAW USING PATTERNED NON-CONDUCTIVE MATERIALS
Document Type and Number:
WIPO Patent Application WO/2012/138063
Kind Code:
A2
Abstract:
The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the present invention, the method for manufacturing the electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.
Inventors:
LEE SEH-KWANG (KR)
SUNG RAK-JOO (KR)
KIM TAE-BONG (KR)
SUNG RAK-JOO (KR)
KIM TAE-BONG (KR)
Application Number:
PCT/KR2012/001943
Publication Date:
October 11, 2012
Filing Date:
March 19, 2012
Export Citation:
Assignee:
EHWA DIAMOND IND CO LTD (KR)
LEE SEH-KWANG (KR)
SUNG RAK-JOO (KR)
KIM TAE-BONG (KR)
LEE SEH-KWANG (KR)
SUNG RAK-JOO (KR)
KIM TAE-BONG (KR)
International Classes:
C25D13/00; B23D61/18; B24B27/06; C25D5/02
Foreign References:
KR20050014522A | 2005-02-07 | |||
JP2010000584A | 2010-01-07 | |||
KR100366466B1 | 2002-12-31 | |||
KR100340851B1 | 2003-02-11 | |||
KR20110018642A | 2011-02-24 |
Other References:
None
See also references of EP 2695973A4
See also references of EP 2695973A4
Attorney, Agent or Firm:
DAE-A INTERNATIONAL IP & LAW FIRM (KR)
특허법인 대아 (KR)
특허법인 대아 (KR)
Download PDF:
Claims:
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