Title:
METHOD FOR MANUFACTURING ELECTROFORMED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/153578
Kind Code:
A1
Abstract:
Provided is a method for manufacturing an electroformed component that is manufactured by electroforming to form a component with a high width-to-height ratio. The present invention comprises: a step for roughening the substrate surface of a metal substrate (10) during a process for transplanting a component (40) so as to prevent the falling over or detachment of the component (40); a step for forming a photoresist pattern (30), which is the inverse pattern of a component pattern, to a desired thickness (T) so as to form a desired aspect ratio for the component (40); a step for forming the component to a height (t) equal to or less than the desired thickness (T) by electroforming with the photoresist pattern (30) serving as a mask; a step for removing the photoresist pattern (30); and a step for transplanting the formed component (40) to a component substrate (90).
Inventors:
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
TERADA TOKINORI (JP)
Application Number:
PCT/JP2012/002550
Publication Date:
October 17, 2013
Filing Date:
April 12, 2012
Export Citation:
Assignee:
LEAP CO LTD (JP)
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
International Classes:
C25D1/10; H01L21/60
Foreign References:
| JPH08138941A | 1996-05-31 | |||
| JPH1065322A | 1998-03-06 | |||
| JPH01316485A | 1989-12-21 | |||
| JPH03207883A | 1991-09-11 | |||
| JPH05136143A | 1993-06-01 | |||
| JP2005183439A | 2005-07-07 | |||
| JP2006054288A | 2006-02-23 | |||
| JPH06163549A | 1994-06-10 | |||
| JP2005163076A | 2005-06-23 |
Attorney, Agent or Firm:
HAGIHARA, MAKOTO (JP)
Makoto Hagiwara (JP)
Makoto Hagiwara (JP)
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