Title:
METHOD FOR MANUFACTURING ELECTROFORMED MOLD, ELECTROFORMED MOLD, AND METHOD FOR MANUFACTURING ELECTROFORMED PARTS
Document Type and Number:
WIPO Patent Application WO/2008/018261
Kind Code:
A1
Abstract:
Provided is a method for manufacturing an electroformed mold. This manufacturing
method forms a first photoresist layer (3) on the upper face of a bottom conductive
film (2) of a substrate (1), and divides the first photoresist layer (3) into a
soluble portion (3b) and an insoluble portion (3a). Next, a conductive material
is heated and deposited within such a temperature range on the upper face of the
first photoresist layer as emits a light of a wavelength to make the first photoresist
layer insensitive, thereby to form an intermediate conductive film (5). After
this intermediate conductive film was patterned, a second photoresist layer
(6) is formed on the upper face of the first photoresist layer exposed by removing
the intermediate conductive film and on the upper face of the intermediate conductive
film left by the patterning. The second photoresist layer is divided into a soluble
portion (6b) and an insoluble portion (6a). Then, the first photoresist layer
and the second photoresist layer are developed to remove the soluble portions
(3b, 6b), thereby to manufacture an electroformed mold (101) having the conductive
film on the bottom of each step.
Inventors:
NIWA TAKASHI (JP)
KISHI MATSUO (JP)
JUJO KOICHIRO (JP)
HOSHINA HIROYUKI (JP)
KISHI MATSUO (JP)
JUJO KOICHIRO (JP)
HOSHINA HIROYUKI (JP)
Application Number:
PCT/JP2007/063743
Publication Date:
February 14, 2008
Filing Date:
July 10, 2007
Export Citation:
Assignee:
SEIKO INSTR INC (JP)
NIWA TAKASHI (JP)
KISHI MATSUO (JP)
JUJO KOICHIRO (JP)
HOSHINA HIROYUKI (JP)
NIWA TAKASHI (JP)
KISHI MATSUO (JP)
JUJO KOICHIRO (JP)
HOSHINA HIROYUKI (JP)
International Classes:
C25D1/10
Foreign References:
| EP1681375A2 | 2006-07-19 | |||
| JPH11293486A | 1999-10-26 | |||
| JPH04200007A | 1992-07-21 | |||
| JPS5260241A | 1977-05-18 | |||
| JPH1115126A | 1999-01-22 | |||
| JPH10245692A | 1998-09-14 |
Other References:
See also references of EP 2053146A4
Attorney, Agent or Firm:
SHIGA, Masatake et al. (YaesuChuo-k, Tokyo 53, JP)
Download PDF: