Title:
METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT SUBSTRATE, AND ELECTRONIC CIRCUIT SUBSTRATE OBTAINED THEREBY
Document Type and Number:
WIPO Patent Application WO/2016/052043
Kind Code:
A1
Abstract:
A method for manufacturing an electronic circuit substrate wherein a prescribed pattern of an electronic circuit comprising a nanoink composition containing metal particles is affixed to a base material, said method having: a step wherein a nanoink composition containing metal particles is held on a printing plate on the surface of which a prescribed pattern of an ink-holding section has been formed; a step wherein the surface of the base material is adhered to the printing plate, and the nanoink composition held in the ink-holding section is transferred to the base material (the workpiece (W)); and a step wherein, after the transfer, the transferred nanoink composition is dried and solidified in the air, in an environment of 40°C or less, thereby forming an electronic circuit having a prescribed pattern. By means of this method it is possible to apply a uniform nanoink composition layer quickly and efficiently at room temperature and atmospheric pressure.
Inventors:
KANEHARA MASAYUKI (JP)
URANO MASAAKI (JP)
URANO MASAAKI (JP)
Application Number:
PCT/JP2015/074627
Publication Date:
April 07, 2016
Filing Date:
August 31, 2015
Export Citation:
Assignee:
KOMURA TECH CO LTD (JP)
International Classes:
H05K3/12; B41M1/04; B41M1/30; B41F3/20; B41F17/14
Domestic Patent References:
| WO2014051066A1 | 2014-04-03 | |||
| WO2011048876A1 | 2011-04-28 |
Other References:
See also references of EP 3203816A4
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
Masahiko Nishifuji (JP)
Masahiko Nishifuji (JP)
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