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Title:
METHOD FOR MANUFACTURING ELECTRONIC-COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/188824
Kind Code:
A1
Abstract:
A method for manufacturing an electronic-component device, said method having the following steps: step A, in which a laminate comprising an electronic component mounted on a mounting body is prepared; step B, in which a sealing sheet is prepared; step C, in which said sealing sheet is placed on top of a heating plate and the laminate is placed on top of the sealing sheet with the surface of the laminate on which the electronic component is mounted facing down; and step D, in which, after step C, hot pressing is used to embed the electronic component in the sealing sheet.

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Inventors:
SENZAI HIROYUKI (JP)
MATSUMURA TAKESHI (JP)
TOYODA EIJI (JP)
IINO CHIE (JP)
Application Number:
PCT/JP2014/060796
Publication Date:
November 27, 2014
Filing Date:
April 16, 2014
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
WO2006100765A12006-09-28
Foreign References:
JP2000294578A2000-10-20
JP2011001473A2011-01-06
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
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