Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/179874
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing an electronic component device, said method comprising; a step of forming a via hole in a curable sealing resin layer disposed on a substrate by an imprint method of pressing a mold from the opposite side from the substrate, said via hole extending in the thickness direction of the sealing resin layer; a step of curing the sealing resin layer; a step of filling the via hole with a conductor precursor body; and a step of forming a conductive via by heating the conductor precursor body with which the via hole is filled.
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Inventors:
SHIBATA TOMOAKI (JP)
OGAWA TSUYOSHI (JP)
LI XINRONG (JP)
OGAWA TSUYOSHI (JP)
LI XINRONG (JP)
Application Number:
PCT/JP2020/009472
Publication Date:
September 10, 2020
Filing Date:
March 05, 2020
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L23/12; H01L23/28; H05K3/00; H05K3/40
Foreign References:
| JP2005093767A | 2005-04-07 | |||
| JP2017222930A | 2017-12-21 | |||
| JP2002033562A | 2002-01-31 | |||
| JP2013239758A | 2013-11-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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