METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PROVIDED WITH ADHESIVE FILM AND METHOD FOR MANUFACTURING MOUNTING BODY

WIPO Patent Application WO/2011/089870

A1

Disclosed is a method for manufacturing an electronic component provided with an adhesive film, wherein cutting dusts and the like are prevented from adhering to an adhesive layer (404) at the time of dividing a wafer in a state wherein the adhesive layer (404) is adhered on the surface of the wafer. The method is provided with: an adhering step wherein the adhesive film, which is formed by laminating a base material (402) and the adhesive layer (404), is adhered on the surface of the wafer having electronic components (122) formed thereon; an image pickup step wherein an image of the surface of the wafer is picked up by receiving light that has been reflected on the surface of the wafer and passed through the base material (402) and the adhesive layer (404); a dividing position determining step wherein the positions where the wafer is to be divided are determined on the basis of the image; and a dividing step wherein the electronic components (122) are separated by dividing the wafer.

JP2011126754	DIAMOND COVERED CUTTING EDGE
JP2003138228	PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR WAFER
JP04256337	MANUFACTURE OF SEMICONDUCTOR CHIP

NISHIMURA, Junichi (1078 Kami-ishikawa Kanuma-sh, Tochigi 03, 〒3228503, JP)

JP2011/000139

July 28, 2011

January 13, 2011

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Sony Chemical & Information Device Corporation (Gate City Osaki, East Tower 8F. 1-11-2 Osaki, Shinagawa-k, Tokyo 32, 〒1410032, JP)
ソニーケミカル＆インフォメーションデバイス株式会社 (〒32 東京都品川区大崎一丁目１１番２号　ゲートシティ大崎イーストタワー８階 Tokyo, 〒1410032, JP)

H01L21/301; B24B49/12; H01L21/304; H01L21/52

RYUKA IP Law Firm (5F Shinjuku Square Tower, 22-1 Nishi-Shinjuku 6-chome, Shinjuku-k, Tokyo 05, 〒1631105, JP)

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