Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/186051
Kind Code:
A1
Abstract:
This method for manufacturing an electronic component is characterized by being provided with: a step for forming, on a substrate, a base layer that has a first metal film comprising Cu, Fe, Ag, or an alloy having any of these as a main component, and subsequently forming, on the outermost layer, a second metal film comprising a metal different from the metal constituting the first metal film, thereby forming an electrode that has two or more layers of metal films; and a step for imparting, to the electrode, a liquid chemical solution which selectively reacts with the metal constituting the first metal film without reacting with the metal constituting the second metal film to crystallize out a resin, an overcoat layer comprising the resin being formed on at least a side surface of the electrode as a result of the resin being crystallized out on an exposed part of the first metal film.
Inventors:
HATASE MINORU (JP)
Application Number:
PCT/JP2018/006942
Publication Date:
October 11, 2018
Filing Date:
February 26, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/28; H05K1/18; H05K3/24
Domestic Patent References:
| WO2010038532A1 | 2010-04-08 |
Foreign References:
| JP2001223460A | 2001-08-17 | |||
| JPH08311658A | 1996-11-26 | |||
| JPS63164491A | 1988-07-07 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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