Title:
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/104001
Kind Code:
A1
Abstract:
Provided are a method for manufacturing an electronic device, wherein generation of warpage is suppressed, and an apparatus for manufacturing an electronic device. The method for manufacturing an electronic device includes a warpage suppressing step wherein the interim product of the electronic device is warped, and a heating step wherein the interim product is heated in the state where the interim product is warped.
Inventors:
MURAI HIDEYA (JP)
IIMORI KIYOKAZU (JP)
MORI KENTARO (JP)
YAMAMICHI SHINTARO (JP)
KAWANO MASAYA (JP)
SOEJIMA KOUJI (JP)
IIMORI KIYOKAZU (JP)
MORI KENTARO (JP)
YAMAMICHI SHINTARO (JP)
KAWANO MASAYA (JP)
SOEJIMA KOUJI (JP)
Application Number:
PCT/JP2010/053614
Publication Date:
September 16, 2010
Filing Date:
March 05, 2010
Export Citation:
Assignee:
NEC CORP (JP)
RENESAS ELECTRONICS CORP (JP)
MURAI HIDEYA (JP)
IIMORI KIYOKAZU (JP)
MORI KENTARO (JP)
YAMAMICHI SHINTARO (JP)
KAWANO MASAYA (JP)
SOEJIMA KOUJI (JP)
RENESAS ELECTRONICS CORP (JP)
MURAI HIDEYA (JP)
IIMORI KIYOKAZU (JP)
MORI KENTARO (JP)
YAMAMICHI SHINTARO (JP)
KAWANO MASAYA (JP)
SOEJIMA KOUJI (JP)
International Classes:
H01L23/12
Foreign References:
| JP2006294850A | 2006-10-26 | |||
| JP2001217285A | 2001-08-10 |
Attorney, Agent or Firm:
KATO, Asamichi (JP)
Asamichi Kato (JP)
Asamichi Kato (JP)
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