Title:
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/047083
Kind Code:
A1
Abstract:
A method for manufacturing an electronic device having a circuit board (10, 10a-10h) that has a substrate through-hole (11), and also having a circuit element (21-23) and a mold resin (40) that has a mold through-hole (41), the method using a first mold (410), a second mold (420-440) having a cavity, and a pressing member (460) that is projected from the bottom surface of the cavity, the method being provided with the features that the circuit board is secured to the first mold (410), the second mold is secured to the first mold so that the opening of the substrate through-hole is blocked by the pressing member (460), and the mold resin is molded while the circuit element is covered with a constituent material inside the cavity. A portion of the pressing member presses against the circuit board while being inserted into the substrate through-hole, whereby the circuit board is deformed such that the area of the opening of the substrate through-hole becomes gradually narrower in the direction from the one surface side to the reverse-surface side.
Inventors:
YAMAGISHI TETSUTO (JP)
TAKENAKA MASAYUKI (JP)
NAGAYA TOSHIHIRO (JP)
HIRAMITSU SHINJI (JP)
TAKENAKA MASAYUKI (JP)
NAGAYA TOSHIHIRO (JP)
HIRAMITSU SHINJI (JP)
Application Number:
PCT/JP2015/004655
Publication Date:
March 31, 2016
Filing Date:
September 14, 2015
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
B29C43/18; H01L21/56; H01L23/28; H05K3/28
Foreign References:
| JP2014150128A | 2014-08-21 | |||
| JPS62254483A | 1987-11-06 | |||
| JP2010129868A | 2010-06-10 | |||
| JPS5725812U | 1982-02-10 | |||
| JPS5961151A | 1984-04-07 | |||
| JPH0360146A | 1991-03-15 | |||
| JPS54106871A | 1979-08-22 |
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
Gold Junki (JP)
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