Title:
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/122894
Kind Code:
A1
Abstract:
This method for manufacturing an electronic device has: a step for mounting a substrate 10, which has a metal plate 11 on the rear side thereof, on a rear-side die 110 which has a die recess 111; a step for positioning a front-side die 120 so as to cover the substrate 10; and a step for pouring a resin between the front-side die 100 and the rear-side die 110 while pressing the substrate 10 against the rear-side die 110. In the step for pouring the resin, the substrate 10 is pressed against the rear-side die 110 with the peripheral edges of the metal plate 11 abutting the edges of the die recess 111.
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Inventors:
KAMADA HIDEKI (JP)
Application Number:
PCT/JP2016/088619
Publication Date:
July 05, 2018
Filing Date:
December 26, 2016
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG (JP)
International Classes:
H01L23/28; H01L21/56; H01L23/34
Foreign References:
| JP2011238803A | 2011-11-24 | |||
| JP2010129868A | 2010-06-10 | |||
| JP2003347484A | 2003-12-05 | |||
| JP2007165692A | 2007-06-28 | |||
| JP2015173170A | 2015-10-01 | |||
| JP2008022033A | 2008-01-31 | |||
| JP2011077280A | 2011-04-14 |
Other References:
See also references of EP 3561864A4
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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