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Patent Searching and Data


Title:
METHOD OF MANUFACTURING ELECTRONIC DEVICES ON BOTH SIDES OF A CARRIER SUBSTRATE AND ELECTRONIC DEVICES THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/021197
Kind Code:
A3
Abstract:
In some embodiments, a method of manufacturing at least one first electronic device and at least one second electronic device. The method can include: providing a carrier substrate having a first side and a second side, a first substrate bonded to the first side of the carrier substrate, and a second substrate bonded to the second side of the carrier substrate; depositing at least one layer of a first material over the first substrate while the first substrate is bonded to the first side of the carrier substrate to create a portion of the at least one first electronic device; and depositing at least one layer of a second material over the second substrate while the second substrate is bonded to the second side of the carrier substrate to create a portion of the at least one second electronic device. In many embodiments, at least one of the first substrate or the second substrate can be a flexible substrate. Other embodiments are disclosed.

Inventors:
LOY DOUGLAS E (US)
MORTON DAVID (US)
HOWARD EMMETT (US)
Application Number:
PCT/US2011/037226
Publication Date:
April 12, 2012
Filing Date:
May 19, 2011
Export Citation:
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Assignee:
UNIV ARIZONA (US)
LOY DOUGLAS E (US)
MORTON DAVID (US)
HOWARD EMMETT (US)
International Classes:
H01L21/20; H01L29/786
Foreign References:
US20060223282A12006-10-05
US20060180815A12006-08-17
US20090211791A12009-08-27
KR100810708B12008-03-07
Attorney, Agent or Firm:
BENYI, Stephen, K. (Two North Central AvenueSuite 220, Phoenix AZ, US)
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