METHOD FOR MANUFACTURING ELECTRONIC MODULE HAVING COMPLEX THREE-DIMENSIONAL SHAPE USING 3D PRINTING TECHNOLOGY AND MANUFACTURING APPARATUS THEREFOR

WIPO Patent Application WO/2016/200222

A1

Provided is an apparatus for manufacturing an electronic module having a complex three-dimensional shape using 3D printing technology. The apparatus, according to the present invention, comprises: a main body having a head unit that includes a nozzle head for spraying a resin and a nozzle head for spraying a conductive material; a structure forming unit that has a first resin feeder connected with the nozzle head for spraying a resin via a first resin feed line to feed a first resin containing a seed forming material and forms a primary structure by means of the first resin cured after being sprayed through the nozzle head for spraying a resin; a primary pattern circuit forming unit that has a laser that applies a laser beam to the surface of the primary structure, and forms a seed layer on the surface of the primary structure along a preset pattern circuit; and a secondary pattern circuit forming unit that has at least one conductive-material feeder connected with the nozzle head for spraying a conductive material via a conductive-material feed line to feed an electro-conductive material and forms a conductive layer for forming a circuit by means of the electro-conductive material sprayed onto the seed layer.

KIM KI HYUN (KR)
SA JIN SUNG (KR)
HWANG SEOK JIN (KR)

PCT/KR2016/006217

December 15, 2016

June 10, 2016

Click for automatic bibliography generation  

OPTO LINE CO LTD (KR)

B29C67/00; B33Y30/00; B33Y50/02

WO2013103600A1	2013-07-11
WO2009141800A2	2009-11-26
WO2014042283A1	2014-03-20

KR101297630B1	2013-08-19
US20090059543A1	2009-03-05

ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
특허법인 이룸리온 (KR)

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