Title:
METHOD FOR MANUFACTURING AN ELECTRONICS MODULE
Document Type and Number:
WIPO Patent Application WO2006056643
Kind Code:
A3
Abstract:
Method for manufacturing an electronic module, which electronic module includes a component (6), which has contact areas (17), which are connected electrically to a conductor- pattern layer (14). The manufacture according to the method starts from a layered membrane, which comprises at least a conductor layer (4) and an insulator layer (10) on the first surface of the conductor layer (4). Contact openings (17), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6), and which penetrate both the conductor layer (4) and the insulator layer (10), are made in the membrane. After the manufacture of the contact openings (17), the component (6) is attached to the surface of the insulator layer (10), in such a way that the contact areas (7) of the component (6) line up next to the contact openings (17). After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made, which connects the component (6) to the conductor layer (4) and the conductor layer (4) is patterned to form a conductor-pattern layer (14).
Inventors:
TUOMINEN RISTO (FI)
IIHOLA ANTTI (FI)
IIHOLA ANTTI (FI)
Application Number:
PCT/FI2005/000499
Publication Date:
November 09, 2006
Filing Date:
November 23, 2005
Export Citation:
Assignee:
IMBERA ELECTRONICS OY (FI)
TUOMINEN RISTO (FI)
IIHOLA ANTTI (FI)
TUOMINEN RISTO (FI)
IIHOLA ANTTI (FI)
International Classes:
H01L23/538; H01L21/48; H01L21/60; H01L23/498; H05K1/18; H01L21/68; H05K3/42; H01L
Domestic Patent References:
| WO2004089048A1 | 2004-10-14 |
Foreign References:
| US6232666B1 | 2001-05-15 | |||
| US20020017711A1 | 2002-02-14 | |||
| US6242282B1 | 2001-06-05 |
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