Title:
METHOD FOR MANUFACTURING ENDLESS CUTTING WIRE FOR INGOT CUTTING
Document Type and Number:
WIPO Patent Application WO/2010/062069
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a cutting edge used for cutting a silicon ingot which is grown as a single or poly crystal, especially for an endless cutting wire of a new mechanism which forms a loop without interruption and cuts the ingot while rotating at high speed on a pulley. The method comprises: preparing at least seven wire strands each of which is made by twisting dozens of thin and small-diameter wires to a uniform thickness and then binding and twisting the prepared strand wires into a single wire rope of larger diameter so that the twist-start point and the opposite twist-end point of the wire strands start and end at different positions, putting each wire strand in the center of other wire strands being twisted when twisting the wire strands, and also putting the twist-end point of each wire strand in the center of other wire strands being twisted. Therefore, an integrated endless cutting wire without a weak portion like a cutoff or knot is manufactured.
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Inventors:
OH JOONG PYO (KR)
Application Number:
PCT/KR2009/006634
Publication Date:
June 03, 2010
Filing Date:
November 12, 2009
Export Citation:
Assignee:
DISEC CO LTD (KR)
OH JOONG PYO (KR)
OH JOONG PYO (KR)
International Classes:
B23D61/18; B23P15/28
Foreign References:
| JPH0663931A | 1994-03-08 | |||
| JPH09234728A | 1997-09-09 | |||
| JPH09314544A | 1997-12-09 |
Attorney, Agent or Firm:
SUNG, Sang Hee et al. (KR)
성상희 (KR)
성상희 (KR)
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