Title:
METHOD FOR MANUFACTURING EXTREME ULTRAVIOLET PELLICLE BY USING ORGANIC SACRIFICIAL LAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/212604
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a lithography pellicle used as an anti-dust film when manufacturing a semiconductor device, a liquid crystal display, etc. and, more specifically, to a method for manufacturing an extreme ultraviolet pellicle. Provided according to the present invention is a method for manufacturing an extreme ultraviolet pellicle, the method comprising the steps of: a) manufacturing an organic substrate; b) forming a first coating layer on the organic substrate; c) forming an inorganic thin film layer on the first coating layer; d) forming a second coating layer on the inorganic thin film layer; e) attaching, to a pellicle frame, the organic substrate on which the first coating layer, the inorganic thin film layer, and the second coating layer are formed; and f) removing at least a part of the organic substrate.
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Inventors:
CHO SANG JIN (KR)
KIM MYUNG JUN (KR)
PARK DON WON (KR)
KIM JI KANG (KR)
LIM JAI DONG (KR)
SEO KYOUNG WON (KR)
KIM MYUNG JUN (KR)
PARK DON WON (KR)
KIM JI KANG (KR)
LIM JAI DONG (KR)
SEO KYOUNG WON (KR)
Application Number:
PCT/KR2018/005648
Publication Date:
November 22, 2018
Filing Date:
May 17, 2018
Export Citation:
Assignee:
FINE SEMITECH CORP (KR)
International Classes:
G03F1/62; G03F7/20
Foreign References:
KR20130074066A | 2013-07-04 | |||
KR20090122114A | 2009-11-26 | |||
KR20120081667A | 2012-07-20 | |||
KR20160057217A | 2016-05-23 | |||
KR20150123145A | 2015-11-03 |
Attorney, Agent or Firm:
DYNE PATENT & LAW FIRM (KR)
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