Title:
METHOD FOR MANUFACTURING FINE PATTERN REPRODUCING DIE
Document Type and Number:
WIPO Patent Application WO/2005/093131
Kind Code:
A1
Abstract:
A method for manufacturing a fine pattern reproducing die includes (1) a process of applying a resist containing silicon on a substrate, drying it and forming a film, (2) a process of exposing the obtained coat film to light, developing it and patterning it, (3) a process of forming a metal plated layer on the obtained resist pattern by plating, and (4) a process of peeling the formed metal plated layer from the substrate and the resist pattern.
Inventors:
SAKURAI YOSHIAKI (JP)
SATO KAZUO (JP)
FUKUDA HIROKI (JP)
MURAKAMI SHUICHI (JP)
INOUE YOTARO (JP)
YOTSUYA TSUTOMU (JP)
SATO KAZUO (JP)
FUKUDA HIROKI (JP)
MURAKAMI SHUICHI (JP)
INOUE YOTARO (JP)
YOTSUYA TSUTOMU (JP)
Application Number:
PCT/JP2005/005368
Publication Date:
October 06, 2005
Filing Date:
March 24, 2005
Export Citation:
Assignee:
OSAKA PREFECTURE (JP)
SAKURAI YOSHIAKI (JP)
SATO KAZUO (JP)
FUKUDA HIROKI (JP)
MURAKAMI SHUICHI (JP)
INOUE YOTARO (JP)
YOTSUYA TSUTOMU (JP)
SAKURAI YOSHIAKI (JP)
SATO KAZUO (JP)
FUKUDA HIROKI (JP)
MURAKAMI SHUICHI (JP)
INOUE YOTARO (JP)
YOTSUYA TSUTOMU (JP)
International Classes:
B29C33/38; C23C18/32; C25D1/00; G02B5/18; G03F7/075; G03H1/02; H01L21/027; (IPC1-7): C25D1/00; B29C33/38; C23C18/32; G02B5/18; G03F7/075; H01L21/027
Foreign References:
| JP2003279716A | 2003-10-02 | |||
| JP2002196494A | 2002-07-12 | |||
| JPS55156015A | 1980-12-04 | |||
| JPH10282677A | 1998-10-23 | |||
| JP2002365805A | 2002-12-18 |
Attorney, Agent or Firm:
Saegusa, Eiji (1-7-1 Doshomachi, Chuo-k, Osaka-shi Osaka 45, JP)
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