Title:
METHOD FOR MANUFACTURING FLEXIBLE COPPER WIRING BOARD, AND FLEXIBLE COPPER-CLAD LAYERED BOARD WITH SUPPORT FILM USED IN SAID COPPER WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/031559
Kind Code:
A1
Abstract:
A flexible copper wiring board used in chip-on film (COF), flexible printed circuit boards (FPC), etc. is accurately manufactured from a flexible copper-clad layered board. This invention is provided with a step for layering copper on one surface side of a resin film, a step for layering a biaxially stretched film as a support film on the other surface side of the resin film with an adhesive layer interposed therebetween, a step for etching the copper and forming copper wiring, a heating step for heating the flexible copper-clad laminate with a support film, and a release step for releasing the support film. What is used for the support film is a biaxially stretched film in which the heat shrinkage ratio in each of the stretching directions after 30 minutes at 150°C is 0.1% or less.
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Inventors:
IGARI ATSUSHI (JP)
Application Number:
PCT/JP2015/072753
Publication Date:
March 03, 2016
Filing Date:
August 11, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
H05K3/06; B32B15/08; B32B15/088; B32B15/09; C09J5/00; C09J7/20
Domestic Patent References:
| WO2006001270A1 | 2006-01-05 |
Foreign References:
| JP2003017822A | 2003-01-17 |
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
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