Title:
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY SAME
Document Type and Number:
WIPO Patent Application WO/2018/221876
Kind Code:
A1
Abstract:
A method for manufacturing a flexible printed circuit board in which base sheets composed of Teflon film having heat resistance and a low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal and a flexible printed circuit board manufactured by the same are disclosed. The proposed method for manufacturing a flexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.
Inventors:
DAN SUNG-BAEK (KR)
Application Number:
PCT/KR2018/005637
Publication Date:
December 06, 2018
Filing Date:
May 16, 2018
Export Citation:
Assignee:
AMOGREENTECH CO LTD (KR)
International Classes:
H05K3/28; B32B15/08; H05K3/40; H05K3/42; H05K3/46
Foreign References:
| EP0374272A1 | 1990-06-27 | |||
| KR101418867B1 | 2014-08-13 | |||
| KR20140014663A | 2014-02-06 | |||
| KR101138109B1 | 2012-04-24 | |||
| KR100567095B1 | 2006-03-31 |
Attorney, Agent or Firm:
HONESTY & JR PARTNERS INTELLECTUAL PROPERTY LAW GROUP (KR)
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