Title:
METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/016206
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a flexible semiconductor device. The manufacturing method is characterized by comprising (i) a step of forming an insulating film on the upper surface of a resin film, (ii) a step of forming an extraction electrode pattern on the upper surface of the resin film, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, and (iv) a step of forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, wherein at least one forming step among the above (i) to (iv) is performed by a printing method. In the manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.
Inventors:
HIRANO, Koichi (())
平野浩一 (())
NAKATANI, Seiichi (())
平野浩一 (())
NAKATANI, Seiichi (())
Application Number:
JP2009/003615
Publication Date:
February 11, 2010
Filing Date:
July 30, 2009
Export Citation:
Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
HIRANO, Koichi (())
平野浩一 (())
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
HIRANO, Koichi (())
平野浩一 (())
International Classes:
H01L29/786; H01L21/336; H01L51/05
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (AOYAMA & PARTNERS, IMP Building 3-7, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, 〒5400001, JP)
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