Title:
METHOD FOR MANUFACTURING FLEXIBLE WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2004/052061
Kind Code:
A1
Abstract:
A method for manufacturing a flexible wiring circuit board having an insulating support film and, formed thereon, a wiring circuit, which comprises the following steps (a) to (d): (a) a step of adhering pressure-sensitively a laminate comprising the insulating support film and an electroconductive layer formed thereon to a transparent hard substrate by the use of a pressure-sensitive adhesive layer from the insulating support film side of the laminate; (b) a step of patterning the electroconductive layer of said laminate, to form the wiring circuit; (c) a step of reducing the adhesion strength of said pressure-sensitive adhesive layer; and (d) a step of peeling the laminate having the wiring circuit formed thereon from the transparent hard substrate so as for the pressure-sensitive adhesive layer to remain on the transparent hard substrate.
Inventors:
WATANABE MASANAO (JP)
IGARI YORIMICHI (JP)
TSUCHIDA SHUJI (JP)
IGARI YORIMICHI (JP)
TSUCHIDA SHUJI (JP)
Application Number:
PCT/JP2003/015240
Publication Date:
June 17, 2004
Filing Date:
November 28, 2003
Export Citation:
Assignee:
SONY CHEMICALS CORP (JP)
WATANABE MASANAO (JP)
IGARI YORIMICHI (JP)
TSUCHIDA SHUJI (JP)
WATANABE MASANAO (JP)
IGARI YORIMICHI (JP)
TSUCHIDA SHUJI (JP)
International Classes:
C09J7/02; C09J4/00; C09J5/00; C09J201/00; H05K3/00; H05K3/06; H05K1/00; H05K3/38; (IPC1-7): H05K3/00
Foreign References:
| JPH0818171A | 1996-01-19 | |||
| JPS63209195A | 1988-08-30 | |||
| JPH06264036A | 1994-09-20 | |||
| JPH07202427A | 1995-08-04 | |||
| JPH11333579A | 1999-12-07 | |||
| JP2002026485A | 2002-01-25 |
Attorney, Agent or Firm:
Abe, Hideki (2-18 Toranomon 1-chom, Minato-ku Tokyo, JP)
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