Title:
METHOD FOR MANUFACTURING FUNCTIONAL COMPONENT AND FUNCTIONAL COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/011410
Kind Code:
A1
Abstract:
The present invention enables a SAW filter element (3) to be shielded (sealed off) from the outside using lead-free solder.
A predetermined number of SAW filter elements (3) are affixed to a ceramic substrate (2) on which electrode parts (2a) are formed at predetermined positions, the predetermined number of open holes (5a) through which the affixed SAW filter elements (3) are exposed are provided, solder foil (5) produced from Bi-Sn-based solder is formed on the ceramic substrate (2), the SAW filter elements (3) exposed through the open holes (5a) are each covered with a cap having an open bottom, and the cap is heated at a temperature at which the solder foil (5) is melted or higher while being pressed toward the ceramic substrate (2). As a result, the melted solder foil (5) gathers in the electrode part (2a) formed on the ceramic substrate (2), and the ceramic substrate (2) and the cap can adhere to each other, thereby enabling sealing.
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Inventors:
NOMOTO Shinichi (23, SENJU-HASHIDO-CHO, ADACHI-K, Tokyo 55, 〒1208555, JP)
埜本 信一 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
埜本 信一 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
Application Number:
JP2011/065864
Publication Date:
January 26, 2012
Filing Date:
July 12, 2011
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO., LTD. (23 SENJU-HASHIDO-CHO, ADACHI-KU Tokyo, 55, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
NOMOTO Shinichi (23, SENJU-HASHIDO-CHO, ADACHI-K, Tokyo 55, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
NOMOTO Shinichi (23, SENJU-HASHIDO-CHO, ADACHI-K, Tokyo 55, 〒1208555, JP)
International Classes:
H01L23/02; H01L23/00; H03H3/08; H03H9/25
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (Takamura Building 5F, 3-14-7 Yushima, Bunkyo-k, Tokyo 34, 〒1130034, JP)
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Claims: