Title:
METHOD OF MANUFACTURING GLASS DEVICE AND GLASS DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/235617
Kind Code:
A1
Abstract:
The present invention addresses the problem of making it possible to more simply provide a glass device comprising a thin glass substrate with a glass thickness of less than or equal to 300 μm. This method of manufacturing a glass device comprises forming one or more through-holes (40) in a glass substrate (10), and making electrical connection through the through-holes (40) between a first wire (14) on a first surface side of the glass substrate and a second wire (15) on a second surface side thereof. After the first wire (14) has been formed, etching is performed to form the through-holes (40) and to decrease the thickness of the glass substrate (10). Thereafter, a wire into the through-holes (40) and the second wire (15) are formed. The thickness of the glass substrate (10) after the decrease in thickness is 50 μm to 300 μm inclusive, and the through-holes (40) have a truncated-cone shape.
Inventors:
SAWADAISHI MASASHI (JP)
Application Number:
PCT/JP2019/022745
Publication Date:
December 12, 2019
Filing Date:
June 07, 2019
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H01L23/15; B23K26/53; C03C15/00; H01L23/32
Domestic Patent References:
| WO2016051781A1 | 2016-04-07 | |||
| WO2014080935A1 | 2014-05-30 |
Foreign References:
| JP2016072433A | 2016-05-09 | |||
| JP2015082534A | 2015-04-27 | |||
| JP2000061667A | 2000-02-29 | |||
| JP2001105398A | 2001-04-17 | |||
| JPS54126215A | 1979-10-01 | |||
| JP2018110668A | 2018-07-19 |
Other References:
TAKASHI YOSHINAGAMINORU NOMURA: "Science & Technology Trends", April 2010, NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY POLICY, article "Trends in R&D in TSV Technology for 3D LSI Packaging"
See also references of EP 3806141A4
See also references of EP 3806141A4
Attorney, Agent or Firm:
HIROSE Hajime et al. (JP)
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