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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING GROUND WORKPIECES, AND CUP GRINDSTONE
Document Type and Number:
WIPO Patent Application WO/2018/030120
Kind Code:
A1
Abstract:
A ground workpiece having a smaller diameter than that of an object to be ground 10 is manufactured by grinding a side surface of the object to be ground 10 through the following steps (a) and (b). In step (a), a cup-type grindstone 30 is arranged such that a central axis 30a is offset from a state of being orthogonal to a central axis 10a of the object to be ground 10 to a state of being parallel thereto. In step (b), while the object to be ground 10 is axially rotated and moved in the axial direction, the cup-type grindstone 30 is axially rotated such that the cup-type grindstone 30 grinds the side surface of the object to be ground 10. By doing so, while the object to be ground 10 is roughly ground by a side surface grindstone part 36 of the cup-type grindstone 30, an outer circumferential side of the object to be ground 10 is finish cut by a bottom surface grindstone part 38 to obtain a ground workpiece.

Inventors:
KITAMURA KAZUMASA (JP)
HOSOKAWA HIROFUMI (JP)
NOGUCHI NOBUCHIKA (JP)
Application Number:
PCT/JP2017/026495
Publication Date:
February 15, 2018
Filing Date:
July 21, 2017
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
International Classes:
B24B1/00; B01D39/00; B01D46/00; B01J35/04; B24B5/04; B24D7/00; C04B38/00
Foreign References:
JPH0631954U1994-04-26
JPS62193756A1987-08-25
JP2006281039A2006-10-19
JPH06335849A1994-12-06
JP2006320806A2006-11-30
CH174402A1935-01-15
JP2001191240A2001-07-17
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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