Title:
METHOD FOR MANUFACTURING HEAT DISSIPATING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/033603
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a heat dissipating substrate that can form fins with excellent precision.
The present invention is a method for manufacturing a heat dissipating substrate D2 provided with: a base 1 on which a heat dissipating part 2 is provided partially on at least one of a front surface and a back surface; and a plurality of fins 21 formed integratedly with the heat dissipating part 2 of the base 1 and provided so as to stand with respect to the base 1. The present invention includes a material preparation step for preparing an intermediate molded body W1 provided with a molded part 15 corresponding to the heat dissipating part 2 and provided with a non-molded part 16 corresponding to parts other than the heat dissipating part, and a forging step for forming fins 21 in the molded part 15 of the intermediate molded body W1. In the forging step, the fins 21 are formed by plastic deformation of the molded part 15 by die forging while preventing deformation of the non-molded part 16.
Inventors:
KOKUBO SADAO (JP)
Application Number:
PCT/JP2016/070538
Publication Date:
March 02, 2017
Filing Date:
July 12, 2016
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
B21J5/02; B21J5/06; B21J5/00
Foreign References:
| JP2005103582A | 2005-04-21 | |||
| JPH06224335A | 1994-08-12 |
Attorney, Agent or Firm:
SHIMIZU Yoshihito et al. (JP)
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