Title:
METHOD FOR MANUFACTURING INFRARED SENSOR
Document Type and Number:
WIPO Patent Application WO/2011/129307
Kind Code:
A1
Abstract:
Provided is a method for bonding an infrared transmitting member capable of suppressing cracking and detachment of an optical filter film, and also provided is a method for manufacturing an infrared sensor capable of suppressing cracking and detachment of an optical filter film while maintaining airtightness. A bonding process (first bonding process) is performed to bond in an airtight manner an infrared transmitting member (6) and a package cover (5) by way of a first bonding section (7) comprising low-melting-point glass (7a), by using laser light (LB) to heat and melt the low-melting-point glass (7a) positioned between the periphery of the infrared transmitting member (6) and the periphery of an opening section (5a) in the package cover (5). In the first bonding process, the low-melting-point glass (7a) is heated and melted by irradiating the laser light (LB) from the package cover (5) side.
Inventors:
AKETA, Takanori (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
明田 孝典 (〒86 大阪府門真市大字門真１０４８番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
OKAMOTO, Takeshi (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
岡本 剛 (〒86 大阪府門真市大字門真１０４８番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
SANAGAWA, Yoshiharu (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
明田 孝典 (〒86 大阪府門真市大字門真１０４８番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
OKAMOTO, Takeshi (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
岡本 剛 (〒86 大阪府門真市大字門真１０４８番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
SANAGAWA, Yoshiharu (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
Application Number:
JP2011/059032
Publication Date:
October 20, 2011
Filing Date:
April 11, 2011
Export Citation:
Assignee:
PANASONIC ELECTRIC WORKS CO., LTD. (1048, Oaza-Kadoma Kadoma-sh, Osaka 86, 〒5718686, JP)
パナソニック電工株式会社 (〒86 大阪府門真市大字門真１０４８番地 Osaka, 〒5718686, JP)
AKETA, Takanori (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
明田 孝典 (〒86 大阪府門真市大字門真１０４８番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
OKAMOTO, Takeshi (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
岡本 剛 (〒86 大阪府門真市大字門真１０４８番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
パナソニック電工株式会社 (〒86 大阪府門真市大字門真１０４８番地 Osaka, 〒5718686, JP)
AKETA, Takanori (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
明田 孝典 (〒86 大阪府門真市大字門真１０４８番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
OKAMOTO, Takeshi (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
岡本 剛 (〒86 大阪府門真市大字門真１０４８番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
International Classes:
G01J1/02; H01L23/02
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (Hokuto Patent Attorneys Office, Umeda Square Bldg. 9F., 12-17, Umeda 1-chome, Kita-ku, Osaka-sh, Osaka 01, 〒5300001, JP)
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Claims: