Title:
METHOD FOR MANUFACTURING INSULATED GOLD BONDING WIRE FOR DOUBLE-LAYER SUPERPOSED PACKAGING OF INTEGRATED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2023/160730
Kind Code:
A1
Abstract:
The present invention discloses a method for manufacturing an insulated gold bonding wire for the double-layer superposed packaging of an integrated circuit, and relates to the technical field of gold bonding wires for microelectronic packaging. The manufacturing method specifically comprises the following steps: the preparation of an alloy sheet; the preparation of an alloy bar; drawing; an annealing treatment; an activation treatment; sputtering of an insulating coating; and rewinding and sub-packaging. In the present invention, the surface of a gold bonding wire in a large-scale integrated circuit and double-layer superposed packaging is provided with a polyaryletherketone insulating coating, so that the gold bonding wire is allowed to contact and intersect with itself during packaging, without any influence on the product performance, the cost and the quality; two high-hardness and high-conductivity materials, i.e. cobalt and germanium, are added, so that the tensile strength of the material is greatly enhanced, wherein under the conditions of a room temperature of 25ºC, the fracture force of a wire sample with a diameter of 20 μm reaches 8.2 Cn, whereas the fracture force of a gold bonding wire with the same diameter is 6.0-6.9 Cn; and the four elements of cobalt, lanthanum, cerium and germanium are added, so that not only is the tensile strength of the material enhanced, but the length of a heat affected zone of FBA is also greatly reduced during packaging and wire bonding.
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Inventors:
LI YANQIONG (CN)
LI SHENGWEI (CN)
LI SHENGWEI (CN)
Application Number:
PCT/CN2023/089202
Publication Date:
August 31, 2023
Filing Date:
April 19, 2023
Export Citation:
Assignee:
SHENZHEN ZHONGBAO NEW MATERIAL TECH CO LTD (CN)
International Classes:
B21C1/02; B21C3/02; C23C14/02; C23C14/12
Domestic Patent References:
| WO2018074857A1 | 2018-04-26 |
Foreign References:
| CN115673007A | 2023-02-03 | |||
| CN105470228A | 2016-04-06 | |||
| CN102127663A | 2011-07-20 | |||
| CN110718525A | 2020-01-21 | |||
| CN104022095A | 2014-09-03 | |||
| CN105374782A | 2016-03-02 | |||
| CN111524811A | 2020-08-11 |
Attorney, Agent or Firm:
WAY INSIGHT IP AGENCY (SPECIAL GENERAL PARTNERSHIP) (CN)
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