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Title:
METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING CIRCUIT WIRING SUBSTRATE, AND TRANSFER FILM
Document Type and Number:
WIPO Patent Application WO/2022/092160
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for manufacturing a laminate with which it is possible to suppress excessive adhesion between a photosensitive layer and a photomask after exposure, and achieve excellent resolution of a pattern formed by the photosensitive layer. This method for manufacturing a laminate comprises: a step for bonding a transfer film having a temporary support, an intermediate layer, and a photosensitive layer and a substrate such that the surface on the opposite side to the intermediate layer side of the photosensitive layer of the transfer film comes into contact with the substrate; a step for peeling the temporary support between the temporary support and the intermediate layer; and a step for forming a pattern by performing exposure processing while the exposed intermediate layer and the mask are brought into contact with each other and further performing development processing after exposure. The surface free energy of the surface on the temporary support side of the intermediate layer is 68.0 mJ/m2 or less.

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Inventors:
ONITSUKA HISASHI (JP)
Application Number:
PCT/JP2021/039686
Publication Date:
May 05, 2022
Filing Date:
October 27, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/11; G03F7/20; G03F7/38; G03F7/40; H05K3/18
Domestic Patent References:
WO2018179640A12018-10-04
Foreign References:
JP2003107719A2003-04-09
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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