Title:
METHOD FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING CIRCUIT WIRING
Document Type and Number:
WIPO Patent Application WO/2022/181485
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a laminate including a pattern having an excellent pattern shape, and a method for manufacturing circuit wiring. This method for manufacturing a laminate comprises: a bonding step for bringing a surface of a photosensitive composition layer of a transfer film having a temporary support and the photosensitive composition layer, the surface being on the opposite side to the temporary support side, into contact with a substrate, and bonding the transfer film and the substrate; an exposure step for subjecting the photosensitive composition layer to pattern exposure; and a developing step for developing the exposed photosensitive composition layer using a developer and forming a pattern. A glass-transition temperature X of the photosensitive composition layer is 110°C or lower, and a glass-transition temperature Y obtained by measurement Y is 125°C or higher.
Inventors:
ONITSUKA HISASHI (JP)
ISHIZAKA SOJI (JP)
ISHIZAKA SOJI (JP)
Application Number:
PCT/JP2022/006659
Publication Date:
September 01, 2022
Filing Date:
February 18, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/027; G03F7/004; G03F7/032; G03F7/033; G03F7/11; G03F7/20; G03F7/40; G06F3/041; H05K3/00; H05K3/06; H05K3/18
Domestic Patent References:
| WO2009038082A1 | 2009-03-26 |
Foreign References:
| JP2020126251A | 2020-08-20 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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