Title:
METHOD OF MANUFACTURING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2021/039566
Kind Code:
A1
Abstract:
Provided is a method of manufacturing a laminate, in which a film-like firing material containing sinterable metal particles and binder components and having the same shape or substantially the same shape and the same size as a semiconductor chip, is provided on a support sheet, the rear surface side of the semiconductor chip and the film-like firing material on the support sheet are attached to face each other, the film-like firing material and the semiconductor chip are peeled off from the support sheet, the side of the film-like firing material of the semiconductor chip to which the film-like firing material is attached is attached to a substrate, and the film-like firing material is heated to 200°C or higher to sinter and bond the semiconductor chip and the substrate.
Inventors:
ICHIKAWA ISAO (JP)
NAKAYAMA HIDEKAZU (JP)
SATO YOSUKE (JP)
NAKAYAMA HIDEKAZU (JP)
SATO YOSUKE (JP)
Application Number:
PCT/JP2020/031399
Publication Date:
March 04, 2021
Filing Date:
August 20, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B22F7/08; B82Y30/00; B82Y40/00; H01L21/52
Domestic Patent References:
| WO2016189986A1 | 2016-12-01 | |||
| WO2005029574A1 | 2005-03-31 | |||
| WO2011125492A1 | 2011-10-13 |
Foreign References:
| JP2009170470A | 2009-07-30 | |||
| JP2016213223A | 2016-12-15 | |||
| JP2019065354A | 2019-04-25 | |||
| JP2013103959A | 2013-05-30 | |||
| JP2018152403A | 2018-09-27 | |||
| JP2017224782A | 2017-12-21 | |||
| JP2019153523A | 2019-09-12 | |||
| JPS6327630B2 | 1988-06-03 | |||
| JP2658915B2 | 1997-09-30 | |||
| JP2635889B2 | 1997-07-30 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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