Title:
METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT AND LAMINATED CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/070607
Kind Code:
A1
Abstract:
A method for manufacturing a laminated ceramic electronic component according to the present disclosure involves: preparing a laminate which has a substantially rectangular parallelepiped shape, is obtained by alternately laminating dielectric layers and inner electrode layers, and has a first surface and a second surface which face each other, a first end surface and a second end surface which face each other, and a first side surface and a second side surface which face each other, wherein an end section of the inner electrode layer is open in the first side surface and the second side surface; producing a ceramic green sheet; performing a pressing process on the ceramic green sheet; using the pressed ceramic green sheet to form side margin portions on the first side surface and the second side surface of the laminate; and firing the laminate on which the side margin portions have been formed.
Inventors:
SATO HISASHI (JP)
HASUNUMA RYOTA (JP)
ETO HIROTOSHI (JP)
HASUNUMA RYOTA (JP)
ETO HIROTOSHI (JP)
Application Number:
PCT/JP2023/032932
Publication Date:
April 04, 2024
Filing Date:
September 08, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01G4/30
Foreign References:
| JP2019145834A | 2019-08-29 | |||
| JP2020036001A | 2020-03-05 | |||
| JP2003178926A | 2003-06-27 | |||
| JP2005103986A | 2005-04-21 |
Attorney, Agent or Firm:
SAIKYO, Keiichiro (JP)
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