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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING LED MODULE USING TRANSFER PRINTING
Document Type and Number:
WIPO Patent Application WO/2019/124893
Kind Code:
A1
Abstract:
A method for manufacturing an LED module is disclosed. The method for manufacturing an LED module comprises the steps of: preparing an array of LED chips on a chip holding part; picking up the array of the LED chips by pressing a transfer film onto the LED chips on the chip holding part; obtaining chip-specific height data for each of the LED chips; and placing the array of the LED chips on a mount substrate by pressing, onto the mount substrate, the LED chips picked up by the transfer film, wherein the step of placing individually controls a load for pressing each of the LED chips onto the mount substrate depending on the chip-specific height data.

Inventors:
YOO TAEKYUNG (KR)
Application Number:
KR2018/015976
Publication Date:
June 27, 2019
Filing Date:
December 17, 2018
Export Citation:
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Assignee:
LUMENS CO LTD (KR)
International Classes:
H01L25/075; H01L21/67; H01L33/00; H01L33/48
Domestic Patent References:
WO2017037475A12017-03-09
Foreign References:
JP6170232B12017-07-26
KR20170096127A2017-08-23
KR20150082414A2015-07-15
KR20070011419A2007-01-24
Attorney, Agent or Firm:
RYU, Changyeol (KR)
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