METHOD FOR MANUFACTURING LED-MOUNTING SUBSTRATE

WIPO Patent Application WO/2023/106177

A1

The purpose of the present invention is to provide a method for manufacturing an LED-mounting substrate capable of catching micro LED chips at predetermined positions even when the LED chips are transferred by laser abrasion, thereby achieving improved mountability and higher reliability of subsequent connections. The present invention provides a method for manufacturing an LED-mounting substrate, the method comprising: a step (opposing step) for causing an insulating-layer-formed surface of an LED-mounting substrate, which comprises a substrate having electrodes, bumps formed on the electrodes and composed of a composite material of an organic component and electrically conductive particles, and an insulating layer formed on at least the bumps, to oppose a surface of an LED-transfer substrate comprising a transparent substrate on which a surface having no electrodes of LEDs is bonded, the opposed surface having electrodes of the LEDs; a step (LED transfer step) for irradiating the LEDs with laser from the transparent substrate side of the LED-transfer substrate to transfer the LEDs onto the LED-mounting substrate; and a step (LED-mounting step) for mounting the transferred LEDs on the LED-mounting substrate.

MIZUGUCHI TSUKURU (JP)
TAJIMA IZUMI (JP)

PCT/JP2022/044136

June 15, 2023

November 30, 2022

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TORAY INDUSTRIES (JP)

H01L21/60; B23K26/36; B23K26/57; H01L21/50; H01L21/67; H01L23/12; H01L33/62

JP2020188037A	2020-11-19
JP2020092159A	2020-06-11
JP2002198394A	2002-07-12
JP2010010319A	2010-01-14
JP2013023684A	2013-02-04
JP2016103524A	2016-06-02
JP2015026707A	2015-02-05
US20210265327A1	2021-08-26
JP2006002035A	2006-01-05
JPH06322350A	1994-11-22
JP2020194886A	2020-12-03
JP2020004939A	2020-01-09
JP2005175170A	2005-06-30

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