Title:
A METHOD OF MANUFACTURING A LIGHT EMITTING DIODE UNIT BODY
Document Type and Number:
WIPO Patent Application WO/2001/020688
Kind Code:
A1
Abstract:
A method of manufacturing a light emitting diode unit body comprises the steps of: a plurality of lamp bodies are bonded to a circuit board which has been cut, and are connected to connections; the member formed thus is buried in a mold core to tightly fix the LED lamp bodies and to expose the position where is required to be injected glue; then the member assembled thus is placed on a set of molds; finally, the copper pillars for fixing are inserted into the member at the same time, then the molds are matched and are injected plastics from an inlet. The method may shorten production time, lowers cost, improves yield, reduces effect on environment. The advantages of the LED unit body produced according to the present invention are that its lightness is uniform, its quality is improved, defective item can be recovered to be repaired.
Inventors:
CHAN TSUNG-WEN (CN)
Application Number:
PCT/CN2000/000240
Publication Date:
March 22, 2001
Filing Date:
August 18, 2000
Export Citation:
Assignee:
CHAN TSUNG WEN (CN)
International Classes:
G09F9/33; G09F13/22; H01L33/48; H01L25/13; (IPC1-7): H01L33/00; H01L23/29; G09F9/33
Foreign References:
| US5833903A | 1998-11-10 | |||
| JPH08202290A | 1996-08-09 | |||
| JPH03206672A | 1991-09-10 |
Attorney, Agent or Firm:
SHANGHAI ZHI XIN PATENT AGENT LTD. (Italy Building Road 446 Zhao Jia Bang Road, Shanghai 1, CN)
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