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Title:
METHOD FOR MANUFACTURING LIGHT EMITTING DIODE UNIT
Document Type and Number:
WIPO Patent Application WO/2011/065321
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a light emitting diode unit, which has: a step wherein an LED chip that emits light having a predetermined wavelength from the light emitting surface thereof is placed on a package substrate; a step wherein a phosphor layer that converts the wavelength of the light emitted from the LED chip is supplied to the surface of the LED chip; and a step wherein the phosphor layer and the LED chip are encapsulated using a glass member by dropping a molten glass droplet at a temperature higher than that of the package substrate and solidifying the droplet on the package substrate, which has placed thereon the LED chip having the phosphor layer supplied thereon. Thus, the light emitting diode unit can be manufactured in a short time, while suppressing deterioration and breakage of the LED chip, the phosphor material and the package substrate.

Inventors:
HATANO TAKUJI (JP)
IKENAGA SHUJI (JP)
TAGUCHI YOSHIHITO (JP)
Application Number:
PCT/JP2010/070785
Publication Date:
June 03, 2011
Filing Date:
November 22, 2010
Export Citation:
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Assignee:
KONICA MINOLTA OPTO INC (JP)
HATANO TAKUJI (JP)
IKENAGA SHUJI (JP)
TAGUCHI YOSHIHITO (JP)
International Classes:
H01L33/56; H01L23/02; H01L33/50
Foreign References:
JP2009256670A2009-11-05
JP2008034546A2008-02-14
JP2005079540A2005-03-24
JP2008244357A2008-10-09
JP2005303285A2005-10-27
JP2008124153A2008-05-29
JP2009252898A2009-10-29
JP2004304161A2004-10-28
JP2007194525A2007-08-02
JP2003292327A2003-10-15
JP2004339039A2004-12-02
JP2004111906A2004-04-08
JP2004153109A2004-05-27
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