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Title:
METHOD FOR MANUFACTURING LIQUID CRYSTAL POLYMER FILM, LIQUID CRYSTAL POLYMER FILM, METHOD FOR MANUFACTURING HIGH FREQUENCY CIRCUIT BOARD MATERIAL, AND METHOD FOR MANUFACTURING HIGH FREQUENCY CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/238082
Kind Code:
A1
Abstract:
The present invention relates to: a method for manufacturing a liquid crystal polymer film having excellent strength; a liquid crystal polymer film manufactured by the method; a method for manufacturing a high-frequency circuit board material; and a method for manufacturing a high-frequency circuit board. More specifically, the present invention provides: a method for manufacturing a liquid crystal polymer film including a thermoplastic liquid crystal polymer film and a thermoplastic liquid crystal polymer layer, the method comprising a step for forming the thermoplastic liquid crystal polymer layer on the surface of the thermoplastic liquid crystal polymer film by using a liquid thermoplastic liquid crystal polymer; a liquid crystal polymer film manufactured by the method; a method for manufacturing a high-frequency circuit board material; and a method for manufacturing a high-frequency circuit board.

Inventors:
MASAKI AKIRA (JP)
MINAKUCHI MASAO (JP)
SUZUKI SHINICHIROU (JP)
KASAHARA JUNYA (JP)
Application Number:
PCT/IB2023/055931
Publication Date:
December 14, 2023
Filing Date:
June 08, 2023
Export Citation:
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Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
B32B15/08; C08J7/04; B32B27/36; H05K1/03
Domestic Patent References:
WO2022163776A12022-08-04
WO2016143523A12016-09-15
Foreign References:
JP2021030631A2021-03-01
JP2022085734A2022-06-08
JPH02307751A1990-12-20
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