METHOD FOR MANUFACTURING MEMS DOUBLE-LAYER SUSPENSION MICROSTRUCTURE, AND MEMS INFRARED DETECTOR

Title:

METHOD FOR MANUFACTURING MEMS DOUBLE-LAYER SUSPENSION MICROSTRUCTURE, AND MEMS INFRARED DETECTOR

Document Type and Number:

WIPO Patent Application WO/2016/086690

Kind Code:

A1

Abstract:

A method for manufacturing an MEMS double-layer suspension microstructure comprises steps of: forming a first film body (310) on a substrate (100), and a cantilever beam (320) connected to the substrate (100) and the first film body (310); forming a sacrificial layer (400) on the first film body (310) and the cantilever beam (320); patterning the sacrificial layer (400) located on the first film body (310) to manufacture a recessed portion (410) used for forming a support structure (520), the bottom of the recessed portion (410) being exposed of the first film body (310); depositing a dielectric layer (500) on the sacrificial layer (400); patterning the dielectric layer (500) to manufacture a second film body (510) and the support structure (520), the support structure (520) being connected to the first film body (310) and the second film body (510); and removing the sacrificial layer (400) to obtain the MEMS double-layer suspension microstructure.

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Inventors:

JING ERRONG (CN)

Application Number:

PCT/CN2015/087594

Publication Date:

June 09, 2016

Filing Date:

August 20, 2015

Export Citation:

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Assignee:

CSMC TECHNOLOGIES FAB1 CO LTD (CN)

International Classes:

B81C1/00; B81B7/02

Foreign References:

CN103759838A	2014-04-30
CN103569946A	2014-02-12
CN102353459A	2012-02-15
CN102543591A	2012-07-04
JP2014170994A	2014-09-18
US20030129824A1	2003-07-10
US20060131697A1	2006-06-22

Other References: