Title:
METHOD FOR MANUFACTURING METAL BONDED BODY, AND METHOD FOR BONDING DIECAST MEMBER
Document Type and Number:
WIPO Patent Application WO/2023/248817
Kind Code:
A1
Abstract:
This method for manufacturing a metal bonded body comprises: a metal member preparing step for preparing a first diecast member 10 which is made of an aluminum-based material and has a first bonding-intended surface 12, and a second diecast member 20 which is made of an aluminum-based material and has a second bonding-intended surface 22; and a metal bonded body forming step in which the first diecast member 10 and a first deformation suppressing member 200 for suppressing deformation of the first diecast member 10 are combined, and, in a state in which the first bonding-intended surface 12 and the second bonding-intended surface 22 are contacted with each other, the first diecast member 10 and the second diecast member 20 are pressed relative to each other such that a pressure is applied to the first bonding-intended surface 12 and the second bonding-intended surface 22, in order to achieve a diffusion bonding of the first diecast member 10 and the second diecast member 20 to form a metal bonded body 100. According to the method of the invention for manufacturing a metal bonded body, it is possible to suppress the escape of pressure during bonding and deformation of the diecast members.
Inventors:
KITAZAWA TOSHIAKI (JP)
Application Number:
PCT/JP2023/021385
Publication Date:
December 28, 2023
Filing Date:
June 08, 2023
Export Citation:
Assignee:
MOLES ACT CO LTD (JP)
International Classes:
B23K20/00
Domestic Patent References:
| WO2012081440A1 | 2012-06-21 |
Foreign References:
| JP2002035955A | 2002-02-05 | |||
| JPS57134284A | 1982-08-19 | |||
| JP2010094712A | 2010-04-30 | |||
| JP2018087381A | 2018-06-07 |
Attorney, Agent or Firm:
MEBUKI IP LAW FIRM (JP)
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