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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING METAL-FILLED MICROSTRUCTURE DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/057150
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for manufacturing a metal-filled microstructure device with which the filling of metal into micropores is easy and in-plane uniformity is also good. This method for manufacturing a metal-filled microstructure device comprises: an anodic oxidation step for performing anodic oxidation on one surface of an aluminum substrate to form, on the one surface of the aluminum substrate, an anodic oxide film with micropores that are present in the thickness direction and barrier layers that are present in the bottoms of said micropores; a barrier layer-removing step after the anodic oxidation step for removing the barrier layers of said anodic oxide film using an aqueous alkaline solution comprising a metal M1 with a higher hydrogen overvoltage than aluminum; a metal-filling step after said barrier layer-removing step for performing electroplating to fill a metal M2 inside said micropores; and a substrate-removing step after said metal-filling step for removing the aluminum substrate to obtain the metal-filled microstructure device.

Inventors:
HOTTA YOSHINORI (JP)
YAMASHITA KOSUKE (JP)
KUROOKA SHUNJI (JP)
Application Number:
PCT/JP2016/077890
Publication Date:
April 06, 2017
Filing Date:
September 21, 2016
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C25D11/20; B82Y40/00; C25D1/00; C25D11/04
Domestic Patent References:
WO2015029881A12015-03-05
WO2015060093A12015-04-30
Foreign References:
JP2008169446A2008-07-24
JP2008270158A2008-11-06
JPS5723093A1982-02-06
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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