Title:
METHOD FOR MANUFACTURING METAL GRID, AND METAL GRID
Document Type and Number:
WIPO Patent Application WO/2012/008120
Kind Code:
A1
Abstract:
Disclosed are a metal grid and a method for manufacturing the metal grid, wherein a slit trench that reaches at least a first silicon layer (11) is formed by dry-etching, in a second silicon portion (12a) attached to a first silicon layer (11) with an insulating layer (12c) therebetween, the slit trench is filled with a metal to the middle of the insulating layer (12c) by electroforming, the inner side surfaces of the slit trench are oxidized and oxide films are formed, then, the rest of the slit trench is filled with the metal by the electroforming, and a metal portion (12b) is formed. Consequently, with the metal grid (DG) having such configuration and the method for manufacturing such metal grid make it possible to more finely form the metal portion of the grid by the electroforming using a silicon substrate.
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Inventors:
YOKOYAMA, Mitsuru (Inc. 1, Sakura-machi, Hino-sh, Tokyo 11, 〒1918511, JP)
Application Number:
JP2011/003854
Publication Date:
January 19, 2012
Filing Date:
July 06, 2011
Export Citation:
Assignee:
KONICA MINOLTA MEDICAL & GRAPHIC, INC. (1 Sakura-machi, Hino-shi Tokyo, 11, 〒1918511, JP)
コニカミノルタエムジー株式会社 (〒11 東京都日野市さくら町１番地 Tokyo, 〒1918511, JP)
コニカミノルタエムジー株式会社 (〒11 東京都日野市さくら町１番地 Tokyo, 〒1918511, JP)
International Classes:
C25D7/00; A61B6/00; C25D5/02; G01N23/04; G01N23/20; G01T7/00
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome,Kita-ku, Osaka-shi, Osaka 05, 〒5300005, JP)
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