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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING METAL MICROSTRUCTURE
Document Type and Number:
WIPO Patent Application WO/2003/037783
Kind Code:
A1
Abstract:
A method for manufacturing a metal microstructure (1) comprising a resin mold (13). For setting a mild manufacturing condition with little damage of the resin mold (13), and for mass−producing a high− precision metal microstructure (1) by uniform casting, this method is characterized by having the step of forming a resin mold laminate by fixing on a conductive substrate (11) a resin mold (13) having a vacancy penetrating in the thickness direction via a photosensitive polymer (12) the chemical composition of which is varied by an electron ray, ultraviolet ray, or a visible ray, the step of exposing the resin type laminate (2) to the electron ray, ultraviolet ray, or visible ray, the step of removing a photosensitized polymer (12c) present in the vacancy of the resin mold (13), and the step of filling the vacant section of the resin type laminate (2) with a metal (14) by casting.

Inventors:
YORITA JUN (JP)
HIRATA YOSHIHIRO (JP)
HAGA TSUYOSHI (JP)
Application Number:
PCT/JP2002/011120
Publication Date:
May 08, 2003
Filing Date:
October 25, 2002
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
YORITA JUN (JP)
HIRATA YOSHIHIRO (JP)
HAGA TSUYOSHI (JP)
International Classes:
B81C1/00; C25D1/00; H01L21/48; H05K3/20; (IPC1-7): B81C1/00
Foreign References:
JP2000252185A2000-09-14
JPH09297391A1997-11-18
JP2001022089A2001-01-26
JP2002148817A2002-05-22
Other References:
See also references of EP 1440931A4
Attorney, Agent or Firm:
Fukami, Hisao (Mitsui Sumitomo Bank Minamimorimachi Bldg. 1-29, Minamimorimachi 2-chome, Kita-k, Osaka-shi Osaka, JP)
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