METHOD FOR MANUFACTURING MIRROR DEVICE

Title:

METHOD FOR MANUFACTURING MIRROR DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/079606

Kind Code:

A1

Abstract:

This method for manufacturing a mirror device provided with a structure including a base part and a movable part supported on the base part, and a mirror layer provided in the movable part comprises: a first step for preparing a wafer having a support layer, a device layer, and an intermediate layer disposed between the support layer and the device layer; a second step for, after the first step, removing a part of each of the support layer, the device layer, and the intermediate layer from the wafer to thereby form a slit in the wafer such that the movable part becomes movable with respect to the base part, and forming a plurality of portions each corresponding to the structure in the wafer; a third step for, after the second step, performing wet cleaning for cleaning the wafer with a cleaning fluid; and a fourth step for, after the third step, cutting out the plurality of portions from the wafer. In the second step, the part of the intermediate layer is removed from the wafer by anisotropic etching.

Inventors:

SUZUKI DAIKI (JP)
MATSUMOTO TAKAHIRO (JP)
IDE TOMOYUKI (JP)
TAKAHASHI MIKITO (JP)

Application Number:

PCT/JP2020/031793

Publication Date:

April 29, 2021

Filing Date:

August 24, 2020

Export Citation:

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Assignee:

HAMAMATSU PHOTONICS KK (JP)

International Classes:

G02B26/08; B81C1/00; G02B26/10

Domestic Patent References:

WO2013115967A1

2013-08-08

Foreign References:

JP2002296517A	2002-10-09
JP2004066379A	2004-03-04
JP2002267996A	2002-09-18
JP2014523848A	2014-09-18
JP2006147995A	2006-06-08
JP2002258205A	2002-09-11
JP2012063413A	2012-03-29
JP2013080068A	2013-05-02
JP2008173719A	2008-07-31
JP2006334697A	2006-12-14

Other References: