Title:
METHOD FOR MANUFACTURING MODULE WITH BUILT-IN COMPONENT, AND MODULE WITH BUILT-IN COMPONENT
Document Type and Number:
WIPO Patent Application WO/2010/018708
Kind Code:
A1
Abstract:
Provided are a method for manufacturing a module with a built-in component, which can be easily manufactured without using a tape and adhesive, and the module with the built-in component.
A core substrate (1) having an opening section (2) is laminated on a first resin layer (10) in an uncured state, and a first circuit component (3) is adhered on a part from which a first resin layer in the opening section is exposed. Then, a second resin layer (20) in an uncured state is laminated on the core substrate (1), a second resin layer is applied in a gap between an inner wall of the opening section (2) and a first circuit component (3), then, the first resin layer (10) and the second resin layer (20) are cured.
Inventors:
NOMURA MASATO (JP)
Application Number:
PCT/JP2009/060496
Publication Date:
February 18, 2010
Filing Date:
June 09, 2009
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
NOMURA MASATO (JP)
NOMURA MASATO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2005101934A1 | 2005-10-27 |
Foreign References:
| JP2008091377A | 2008-04-17 | |||
| JP2000332057A | 2000-11-30 | |||
| JP2007012761A | 2007-01-18 | |||
| JP2009081423A | 2009-04-16 |
Attorney, Agent or Firm:
TSUTSUI HIDETAKA (JP)
Hidetaka Tsutsui (JP)
Hidetaka Tsutsui (JP)
Download PDF:
Previous Patent: GALLIUM OXIDE-TIN OXIDE BASED OXIDE SINTERED BODY AND OXIDE FILM
Next Patent: PRODUCTION PLAN MAKING PROGRAM, DEVICE, AND METHOD
Next Patent: PRODUCTION PLAN MAKING PROGRAM, DEVICE, AND METHOD