Title:
METHOD FOR MANUFACTURING MOLD AND MOLD
Document Type and Number:
WIPO Patent Application WO/2010/010860
Kind Code:
A1
Abstract:
Disclosed is a mold comprising a base (10). The base (10) comprises tungsten carbide particles (21) bonded to one another through a bonding phase (22). The mold further comprises a modification surface layer (113) comprising tungsten carbide particles (21) and a filler material composed mainly of copper (23) and filled into portions among the tungsten carbide particles (21) to bond the tungsten carbide particles (21) to one another. The modification surface layer (113) is provided on at least a part of the surface of the base (10). The depth of the modification surface layer (113) is preferably not less than the average particle diameter of the tungsten carbide particles and is preferably 1 to 10 μm. Regarding the surface of the tungsten carbide particles (21) provided on the surface layer remote from the base in the modification surface layer (113), preferably, the surface of the tungsten carbide particles (21) remote from the base is covered with a surface layer composed mainly of copper.
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Inventors:
UEMURA Kensuke (LTD. Research Laboratory 8-2 Kamisuwa,Tubame-sh, Niigata 81, 〒9590181, JP)
Application Number:
JP2009/063011
Publication Date:
January 28, 2010
Filing Date:
July 20, 2009
Export Citation:
Assignee:
IBIDEN Co., Ltd. (1 Kandacho 2-chome, Ogaki-shi Gifu, 24, 〒5038624, JP)
イビデン株式会社 (〒24 岐阜県大垣市神田町２－１ Gifu, 〒5038624, JP)
イビデン株式会社 (〒24 岐阜県大垣市神田町２－１ Gifu, 〒5038624, JP)
International Classes:
C23C26/00; B28B3/26; C23F1/00
Attorney, Agent or Firm:
AICHI, Takahashi, Iwakura & Associates (Meieki Nagata Building, 26-19 Meieki 3-chome, Nakamura-ku, Nagoya-sh, Aichi 02, 〒4500002, JP)
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