Title:
METHOD FOR MANUFACTURING MOLDING DIE, MOLDING DIE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/163850
Kind Code:
A1
Abstract:
Provided are: a molding die which has a heat insulating layer having embedded therein a low heat-conductive material in a prescribed state; and a method for manufacturing a resin molded article. A molding die 40 has heat insulating layers 63, 73 for suppressing heat transfer of a resin RM injected into a molding cavity CV. The heat insulating layers 63, 73 have a heat shielding body 63a that suppresses heat conduction, and a holding part 63b that holds the heat shielding body 63a on a mold 62 which is a body member. The holding part 63b is formed by means of vapor deposition.
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| JPH02194914 | MOLD AND FORMING METHOD THEREOF |
| JP3465999 | PRODUCTION OF MOLD RELEASE SHEET OR MOLD RELEASE FILM |
| WO/2001/084547 | DISC MOLDING APPARATUS FOR COMPACT DISC |
Inventors:
SATOU MASANORI (JP)
TAGAWA TOMOHIKO (JP)
KOBIYAMA WATARU (JP)
TAGAWA TOMOHIKO (JP)
KOBIYAMA WATARU (JP)
Application Number:
PCT/JP2019/006406
Publication Date:
August 29, 2019
Filing Date:
February 20, 2019
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B29C33/38; B29C45/26
Foreign References:
| JPH1034663A | 1998-02-10 | |||
| JP2014046590A | 2014-03-17 |
Attorney, Agent or Firm:
FUKUDA, Mitsuhiro (JP)
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