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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING MOLDING DIE, MOLDING DIE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/163850
Kind Code:
A1
Abstract:
Provided are: a molding die which has a heat insulating layer having embedded therein a low heat-conductive material in a prescribed state; and a method for manufacturing a resin molded article. A molding die 40 has heat insulating layers 63, 73 for suppressing heat transfer of a resin RM injected into a molding cavity CV. The heat insulating layers 63, 73 have a heat shielding body 63a that suppresses heat conduction, and a holding part 63b that holds the heat shielding body 63a on a mold 62 which is a body member. The holding part 63b is formed by means of vapor deposition.

Inventors:
SATOU, Masanori (Inc. 2-7-2 Marunouchi, Chiyoda-k, Tokyo 15, 〒1007015, JP)
TAGAWA, Tomohiko (Inc. 2-7-2 Marunouchi, Chiyoda-k, Tokyo 15, 〒1007015, JP)
KOBIYAMA, Wataru (Inc. 2-7-2 Marunouchi, Chiyoda-k, Tokyo 15, 〒1007015, JP)
Application Number:
JP2019/006406
Publication Date:
August 29, 2019
Filing Date:
February 20, 2019
Export Citation:
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Assignee:
KONICA MINOLTA, INC. (2-7-2 Marunouchi, Chiyoda-ku Tokyo, 15, 〒1007015, JP)
International Classes:
B29C33/38; B29C45/26
Attorney, Agent or Firm:
FUKUDA, Mitsuhiro (Kotani Bldg. 1F, 5-3 Uchikanda 2-chome Chiyoda-ku Tokyo, 47, 〒1010047, JP)
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