Title:
METHOD OF MANUFACTURING MOUNTING BOARD, AND DEVICE FOR MANUFACTURING MOUNTING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/104351
Kind Code:
A1
Abstract:
This method of manufacturing a mounting board is provided with: a provisional pressure bonding step of provisionally pressure bonding a driver 40 and a flexible board 30 respectively; a driver main pressure bonding step of thermocompression bonding the driver 40 using a pressure bonding head 52 having a driver pressing surface 53 and a flexible board pressing surface 54, in which pressure is applied to the driver 40 while a cushioning material 57 is elastically deformed; and a flexible board main pressure bonding step of thermocompression bonding the flexible board 30 using the pressure bonding head 52, in which the pressure bonding head 52 is moved in a direction approaching a glass substrate GS, in such a way that the height of the flexible board pressing surface 54 relative to a mounting surface 21 is the same as the height of the driver pressing surface 53 relative to the mounting surface 21 in the driver pressure bonding step, and pressure is applied to the flexible board 30 while the cushioning material 57 is elastically deformed.
Inventors:
YAMAGUCHI KATSUHIRO
Application Number:
PCT/JP2015/085470
Publication Date:
June 30, 2016
Filing Date:
December 18, 2015
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H01L21/60; G02F1/1345; H05K3/32
Domestic Patent References:
| WO2010095311A1 | 2010-08-26 |
Foreign References:
| JP2009157200A | 2009-07-16 | |||
| JP2000275593A | 2000-10-06 | |||
| JP2010283131A | 2010-12-16 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
Patent business corporation dawn joint patent firm (JP)
Patent business corporation dawn joint patent firm (JP)
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