Title:
METHOD FOR MANUFACTURING MOUNTING SUBSTRATE, AND COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/044688
Kind Code:
A1
Abstract:
This method for manufacturing a mounting substrate comprises a first outline position acquiring step, a feature portion position acquiring step, a calculating step, a holding step, a second outline position acquiring step, and a mounting step. In the first outline position acquiring step, a first outline position of a component is acquired. In the feature portion position acquiring step, the position of a feature portion is acquired. In the calculating step, an amount of position error of the feature portion relative to the first outline position is calculated. In the second outline position acquiring step, a second outline position of the component is acquired. In the mounting step, the component is mounted such that the feature portion of the component is positioned over a target position of a substrate on the basis of the second outline position and the position error amount.
Inventors:
NISHI SYOICHI
SUMI HIDEKI
MURATA HIROSHI
SAKURAI KOJI
ICHIKAWA KENICHI
SUMI HIDEKI
MURATA HIROSHI
SAKURAI KOJI
ICHIKAWA KENICHI
Application Number:
PCT/JP2020/022605
Publication Date:
March 11, 2021
Filing Date:
June 09, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| WO2016035135A1 | 2016-03-10 |
Foreign References:
| JP2015126216A | 2015-07-06 | |||
| JP2016157754A | 2016-09-01 | |||
| JP2013214781A | 2013-10-17 |
Other References:
See also references of EP 4027765A4
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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