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Title:
METHOD FOR MANUFACTURING A MULTILAYER FILM FOR USING IN A MAGNETIC HEAD FOR RECORDING INFORMATION
Document Type and Number:
WIPO Patent Application WO/1999/061676
Kind Code:
A1
Abstract:
In a method of manufacturing a multilayer film consisting of a stack of primary soft-magnetic layers and secondary non-magnetic layers on a substrate by way of reactive sputtering, use is made of one type of target at least as regards composition for alternately depositing a primary and a secondary layer, which target is particularly made of an FeHf alloy. For performing a sputtering process, use is preferably made of a gas mixture of Ar and O¿2? in which the quantity of O¿2? in the gas mixture is controllable and is smaller for sputtering the soft-magnetic layers than for sputtering the non-magnetic layers.

Inventors:
BLOEMEN HENDRIKUS F B
KLAASSENS WILCO
Application Number:
PCT/IB1999/000943
Publication Date:
December 02, 1999
Filing Date:
May 25, 1999
Export Citation:
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Assignee:
KONINKL PHILIPS ELECTRONICS NV (NL)
PHILIPS SVENSKA AB (SE)
International Classes:
C23C14/00; C23C14/14; G11B5/147; C23C14/34; G11B5/31; H01F41/18; (IPC1-7): C23C14/14; G11B5/31
Foreign References:
US5429731A1995-07-04
Other References:
DATABASE WPI Derwent World Patents Index; AN 1990-152661/20, XP002921519
Attorney, Agent or Firm:
Schrijnemaekers, Hubert J. M. (Prof. Holstlaan 6 AA Eindhoven, NL)
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Claims:
CLAIMS:
1. A method of manufacturing a multilayer film consisting of a stack of primary softmagnetic layers and secondary nonmagnetic layers on a substrate by way of reactive sputtering, characterized in that use is made of one type of target at least as regards composition for alternately depositing a primary and a secondary layer.
2. A method as claimed in claim 1, characterized in that use is made of one target only for depositing the primary and secondary layers.
3. A method as claimed in claim 1, characterized in that use is made of a known sputtering device for depositing the primary and secondary layers, in which device a plurality of targets having an identical or substantially identical composition is provided and in which a plurality of substrates is simultaneously provided with one of said layers.
4. A method as claimed in claim 3, characterized in that the substrates are placed on a support which is moved along the relevant targets.
5. A method as claimed in any one of the preceding claims, characterized in that the softmagnetic layers are sputtered by means of an inert gas such as Ar, possibly in combination with a gas from the group of gases comprising, inter alia 02, N2, CH4, and the nonmagnetic layers are sputtered by means of a gas from the group of gases comprising, inter alia °2, N2, CH4, possibly in combination with an inert gas such as Ar.
6. A method as claimed in claim 5, characterized in that the softmagnetic and nonmagnetic layers are sputtered by means of an inert gas such as Ar mixed with O2, in<BR> which the percentage of 0 in the gas mixture is smaller for sputtering the softmagnetic layers than for sputtering the nonmagnetic layers. <BR> <BR> <P>7.
7. A method as claimed in claim 6, characterized in that the quantity of 02 in the gas mixture is controllable.
8. A method as claimed in any one of the preceding claims, characterized in that the target is composed of an FeM or a CoxMy alloy, in which M is at least one element of the group comprising, inter alia Nb, Zr, Hf, Ti, Ta, Si and x is an atom percentage of at least 80.
9. A multilayer film manufactured by means of the method as claimed in any one of claims 18.
10. A magnetic head provided with a multilayer film as claimed in any claim 9.
11. A device for recording and/or reproducing information, provided with a magnetic head having a multilayer film as claimed in claim 9.
Description:
METHOD FOR MANUFACTURING A MULTILAYER FILM FOR USING IN A MAGNETIC HEAD FOR RECORDING INFORMATION

The invention relates to a method of manufacturing a multilayer film consisting of a stack of primary soft-magnetic layers and secondary non-magnetic layers on a substrate by way of reactive sputtering.

Reactive sputtering is a technique which has been known for a long time, in which a target is bombarded with ions from a plasma which is generated by inserting a gas into a vacuum reactor vessel in which a substrate on which a layer must be provided is placed opposite the target, and by applying a high voltage which is negative with respect to the wall of the reactor vessel to the cathode formed by the target. The ions are thereby accelerated towards the target where cascade collisions are generated which result in an exiting of target material atoms located close to the surface. The direction of the particles thus sputtered with respect to the normal on the target surface is mainly cosine-distributed. It is common practice to use an inert gas such as Ar (or possibly, for example, Kr or Xe) in the reactor vessel, although also N2,02 or CH4 and the like may be used or added to the inert gas, dependent on specific applications.

This sputter-deposition technique is used, inter alia, for manufacturing multilayer films for magnetic heads. The multilayer film consists of a stack of primary soft- magnetic layers and secondary non-magnetic layers on a substrate. Particularly, the primary soft-magnetic layers have a thickness of the order of 0.1 to 10, um and the secondary non- magnetic layers have a thickness of the order of 100 to 300 nm.

Examples of applying a soft-magnetic layer on a substrate by way of sputtering are given in, inter alia, US-A-5,466,539. This patent states (in column 2, lines 64- 67 and column 3, line 1) for example, a primary soft-magnetic layer which consists of an FexMy alloy, in which M is at least one element of the group comprising inter alia Nb, Zr, Hf, Ti, Ta, Si and x is an atom percentage of approximately 90% and y is an atom percentage of approximately 10%, which soft-magnetic layer is provided by means of a gas <BR> <BR> <BR> mixture consisting of Ar with approximately 3 % of 02. The soft-magnetic layer mentioned in this US patent has a thickness of 1.5 yxm and is provided by way of sputtering with the aid of a plasma obtained from said gas mixture on a Si02 substrate which has a thickness of

approximately 0.5 mm.

In the conventional manufacture of multilayer films for magnetic heads, sputtering techniques as described hereinbefore are used, in which the different composition of the primary soft-magnetic layer and the secondary non-magnetic layer is based on different targets. For example, it is known to use a CoZrNb target for the primary soft-magnetic layer and a ZrO2 target for the non-magnetic layer. Thus, two targets having a different composition are used every time.

It is an object of the invention to improve the known method in this respect and provide the possibility of producing multilayer films at lower cost, particularly for magnetic heads.

In accordance with the invention, the method as described in the opening paragraph is therefore characterized in that use is made of one type of target at least as regards composition for alternately depositing a primary and a secondary layer. This means that either one target can be used for depositing both types of layers, or a plurality of targets having an identical or substantially identical composition can be used. In the latter case, use may be made of a known sputtering device for depositing the primary and secondary layers, in which device a plurality of targets is provided and in which a plurality of substrates is simultaneously provided with one of said layers.

Hitherto, these known sputtering devices have made use of targets which differ as far as composition is concerned, for example, a target consisting of an Fe alloy or the above-mentioned CoZrNb target for the soft-magnetic layers, and a target consisting of, for example ZrO2 or SiO2 for the non-magnetic layers. Since the substrates in these known sputtering devices are placed on a support which can be rotated underneath the relevant targets, a number of substrates can be alternately provided with soft-magnetic and non- magnetic layers in a continuous process. However, since the thickness of both types of layers varies quite considerably, the provision of notably a soft-magnetic layer will require much more time than the provision of a non-magnetic layer. After a non-magnetic layer has been deposited, a relatively long waiting time is thus to be observed, namely until also the soft- magnetic layer has been deposited, before the supports can be rotated underneath a different target where they can be sputtered with a layer having a different composition.

However, if all targets have the same composition, the support in the known sputtering device does not need to be rotated, and a number of substrates can be sputtered simultaneously in this device alternately with a soft-magnetic layer and a non- magnetic layer. For sputtering the alternate layers simultaneously, the composition of the gas

mixture is then to be adapted synchronously; this will be elucidated hereinafter. By using only one type of target as far as composition is concerned, waiting times in the production of multilayer films can be prevented in the known sputtering device.

It may be advantageous in the known sputtering devices to rotate the support in the case of parallel production of multilayer films in spite of the fact that all targets are identical. Since a certain inhomogeneous distribution is inherent in the sputtering process, the thickness of the layer to be provided may exhibit differences and variations. By rotating the support, such differences and variations in the layer thickness can be averaged.

As already noted, it is essential for the present invention that both a soft- magnetic and a non-magnetic layer can be provided from one target. The following description will be based on a target which is composed of an FeM alloy, in which M is at least one element of the group comprising, inter alia, Co, Nb, Zr, Hf, Ti, Ta, Si, and, for describing a specific embodiment, an FeHf alloy in which the atom percentage of Fe is at least 80% and preferably 90%. The plasma used in the sputtering device is obtained from a mixture of an inert gas such as Ar, although, for example also Kr or Xe could be used, and <BR> <BR> <BR> a gas from the group of gases constituted, inter alia, bye2, N2, CH4; however, the<BR> <BR> <BR> description of a specific embodiment is based on a mixture of Ar and °2-The inert gas is used in the sputtering device for releasing particles from the target, while the addition thereto is bound with the atoms on the surface of the target and the substrate and, for only a very small part, with the particles released from the target in so far as they have not been bound by the addition.

To be able to deposit both a soft-magnetic layer and a non-magnetic layer from one type of target, the mixing ratio of the gas and, in the specific embodiment, the <BR> <BR> <BR> percentage of 0 in the gas mixture will be different for depositing the different layers;<BR> <BR> <BR> particularly, the quantity of °2 in the gas mixture is controllable in the specific embodiment.<BR> <BR> <BR> <P>The percentage of °2 may, in principle, be controlled to such an extent that pure Ar can be<BR> <BR> <BR> used for depositing a soft-magnetic layer and pure 0 can be used for depositing a non-<BR> <BR> <BR> magnetic layer. In any case, the percentage of 02 in the gas mixture is smaller for sputtering<BR> <BR> <BR> a soft-magnetic layer than for sputtering a non-magnetic layer. The quantity of 02 in the gas mixture can be controlled at the location of the plasma. It is alternatively possible to prepare the desired gas mixtures of Ar and2 in advance.

When sputtering a non-magnetic layer from an FeHf target in a plasma <BR> <BR> comprising a relatively large percentage of °2, a non-magnetic layer of Fe and Hf oxides is<BR> <BR> <BR> formed. If, instead of being mixed with °2, the inert gas were mixed with a relatively large

percentage of N2 or CH4, non-magnetic layers of Fe and Hf nitrides or carbides would be deposited.

When sputtering a soft-magnetic layer from an FeHf target, a relatively <BR> <BR> <BR> small quantityof 02 or no °2 iS used; mainly, only the Hf will be bound with it due to its<BR> <BR> <BR> affinity for 0 ; which is greater than for Fe. When the percentage of 02 in the gas mixture increases, the resistance of the relevant layer will, however, increase rapidly.

When a multilayer film consisting of a number of soft-magnetic layers alternating with a number of non-magnetic layers, for example, a number of ten layers each is obtained by means of said sputter-deposition technique, the packets obtained can be provided onto one another with a bonding layer in such a way that the packet of layers is located between two substrates, in which case the magnetic head obtained is referred to as sandwich magnetic head. The magnetic head obtained may be used in all types of known devices for recording and/or reproducing information.